By enabling high-speed edge AI processing and extracting only the necessary data, it solves the issues of data transfer delay time when using cloud services, privacy concerns, and power consumption and communication costs. This technology has realized various functions such as outputting metadata without outputting the image information, real-time tracking of objects through high-speed AI processing, and rewriting built-in memory to select an AI model that matches the user's environment and conditions of use. This sensor is equipped with AI image analysis and processing functionality on the logic chip using stacked configuration consisting of a pixel chip and a logic chip. Sony's commercialized intelligent vision sensors "IMX500" and "IMX501," the world's first image sensors with AI processing functionality. It received the 65th Okochi Memorial Production Prize.
It has been adopted in products such as smartphones and has become one of the key technologies behind Sony's CMOS image sensor. Cu-Cu bonding enables downsizing and productivity improvement, and the improved degree of freedom in terminal layout and higher density provided by this technology has contributed to higher functionality of the stacked CMOS image sensor. Cu-Cu bonding does not need to penetrate the pixel chip or require a dedicated area for connection as the pixel chip and the logic chip are directly connected by copper (Cu) terminals formed on the respective stacked surfaces. Since TSV penetrates the pixel chip, it cannot be arrayed in the pixel area, and is formed in the dedicated peripheral region. Generally, a through-silicon via (TSV) is used for conduction between the pixel chip and the logic chip of the stacked CMOS image sensor. Sony was the first company in the world to implement Cu-Cu bonding for stacked image sensors.
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The column-parallel A/D conversion method has been adopted in various products such as professional video cameras and mobile phones, after it's installment in the digital single-lens reflex camera "α700" for advanced amateur photographers released in November 2007, and has become one of the key technologies that enable Sony's CMOS image sensor. In addition, low noise has been achieved by the dual noise cancellation method that performs highly accurate noise cancellation in both analog and digital circuits.
To correct this, the column-parallel A/D conversion method arranges A/D converters in parallel for each perpendicular row of pixels and transmits the analog signals read out on the vertical signal lines directly to the A/D converters in each row in the shortest possible time, thus minimizing the image quality degradation caused by noise mixed in during analog transmission and enabling high-speed signal readout. The CMOS image sensor has the advantages of low voltage, low power consumption, and high-speed signal processing, but due to their construction, the noise is noticeable in dark environments and underexposed situations. Commercialized "IMX021" CMOS image sensor with 12.47 million effective pixels in APS-C size (diagonal 28.40mm/1.8 type), which adopts the original column parallel A/D conversion method and realizes high-speed and high-quality images with less noise.
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